Low Power x86 Processor |
• Intel® Core™2 Duo Processor L7400
• Core Speed: 1.5 GHz
• Front-Side Bus-Speed: 667 MHz
• L2 Cache: 2048KB Unified
• Intel® 945GM chipset
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RAM Memory |
2048MB DDR2 666MHz SODIMM 200pin
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Solid State Disk |
• Ships with 16GB / 8GB Non-Volatile Industrial CompactFlash, Pre-installed (Other Capacities by Special Order)
• Support for Two (2) Internal IDE CompactFlash and one (1) SATA 1.8" Solid State Disks (SSD) without Taking up Slots in Card Cage
• eSATA Interface on MIL-C-38999 for External HDD/NAS Storage Device
• Support for Removable CF Storage Media (Behind Sealed Cover on Connector Panel)
• Options: Storage Capacity Upgrades (up to ~32GB CompactFlash / ~128GB 1.8” SATA SSD); 2nd Pre-Installed CompactFlash and/or 1.8" SATA Flash Drive; Other Form Factor PATA/SATA Drives in PC104 Card Cage Slots.
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Operating System |
• Pre-installed Linux / Windows
• Hardware Compatible with All x86 Embedded and Real-Time Operating Systems (i.e. Windows Embedded Standard 7, Windows XPe, WinCE, Linux, QNX, VxWorks)
• Wind River VxWorks Board Support Package (BSP) RTOS Support Available
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Bus Architecture |
PCI Bus Complying with PCI-104 Standard (no ISA)
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Network |
• 1x 1000Mbps Gigabit Ethernet Interface
• 1x 100Mbps Fast Ethernet Interface
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Serial |
2x RS-232 Serial Ports
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USB |
6x USB 2.0 Ports
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Key/Mouse |
PS/2 Keyboard and Mouse |
Audio |
AC97 Audio Set: Line In, Line Out, Microphone
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Video |
• 1x VGA Analog Video Output
• 1x LCD Digital Output (LVDS) |
Power |
• 24Vdc Battery / 28Vdc Vehicle Power Input Voltage (18V to 33VDC Continuous)
• Reverse, Over Voltage, 250V Spike, 100V Surge-Protected
• MIL-STD-704F and MIL-STD-1275D Compliance
• Power Consumption for Base System: <40W Max
• Add'l Power Available for Expansion Cards: Approx. 35W
• Graceful OS Shutdown Support and Power Switch
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Status |
Five LED Status/Activity Indicators: One for Power, Four are User-Defined
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Physical |
• Chassis: Aluminum alloy, Corrosion Resistant, Sealed
• Installation: Flange Mount Baseplate
• Cooling: Passive Conductive. No Moving Parts
• Finish: Anodized per MIL-A-8625, Type II, Class 2
• Weight: <8.0 lbs (3.6 kgs)
• Chassis Dimensions (LxWxH): 10.60”(269.24mm) x 5.30”(134.62mm) x 5.30”(134.62mm) including Connectors
• Mounting Flange Dimensions (LxWxH): 5.30”(134.62mm) x 6.45”(163.83mm) x 0.375”(9.53mm)
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Environmental |
Tested and Qualified to Meet MIL-STD-810G:
• Operating Temperature: -40ºC* to +71ºC Ambient (-40ºF to +160ºF)
Note: *Reliable Audio Functionality -30ºC and Above
• Non-Operating Temperature: -40ºC to +85ºC (-40ºF to +185ºF)
• Humidity: Up to 100% RH @ 40°C (Condensing) per MIL-810G, Method 507.3, Procedure I (All Boards are Conformally Coated per MIL-I-46058C)
• Operational Shock: 40G, 11ms sawtooth, 3 pulses per axes, total 18 pulses per MIL-STD-810G Section 516.5
• Crash Hazard Safety: 75G
• Vibration: per MIL-810G Section 514.5 for Ground Mobile/Jet-Helo Profiles
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EMI/EMC |
Tested and Qualified to MIL-STD-461F:
• CE102, Power Leads, 10 KHz to 10MHz, basic curve
• CS101, Power Leads, 30 Hz to 150 KHz, curve 2 (28V and below)
• RE102, Electric Field, 10 KHz to 18 GHz, figure 3, fixed wing <25 meters
• RS103, Electric Field, 30 MHz to 18 GHz (200V/Meter)
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Ingress Protection |
Fully Gasketed and Sealed Chassis/Connectors
• Leakage (Immersion) - Designed to Meet MIL-STD-810F, Method 512, Procedure I (1 Meter, 2 Hours)
• Blowing Rain - Designed to Meet MIL-STD-810F, Method 506.4, Procedure I
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Reliability |
• No Moving Parts. Near Cableless Design
• Mean Time Between Failure (MTBF) per MIL-HDBK-217F @ 25°C / 40°C / 71°C:
• 131,966 / 74,160 / 17,903 Hours (Ground Benign, Controlled)
• 33,777 / 25,496 / 10,481 Hours (Ground Mobile) |
Warranty |
1 Year RTF Warranty (Extended Service Contracts Available)
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Starter Cable Set |
• Starter Cable Set Provides I/O Break-out for CPU I/O (on J1, J3) and Power Input (on J5): Gigabit Ethernet, 10/100 Ethernet, 6 USB, 2 Serial, VGA, LVDS, eSATA, PS2 Keyboard/Mouse, Power Shutdown Switch
• Mates with System MIL-DTL-38999 / IP68 Hirose Connectors to Provide Standard PC-Style Interfaces for Lab or Bench Testing Purposes. |
Special Order / Custom Options |
• Breakout Cable for User Defined Expansion I/O (on J2) with Professional Services Subsystem Integration Projects
• Customized Embedded Windows (WES) / Real Time Operating Systems (RTOS) Images
• Pre-installed 2nd CompactFlash and/or 1.8" SATA Flash Drive
• Integrated Data Device Corp (DDC) MIL-STD-1553 Databus Controllers (1 to 4 channels)
• Other Integrated PCI-104 or PC/104+ I/O or Datacom Modules
• SSD Storage Capacity Upgrades (up to ~32GB CompactFlash / ~128GB 1.8” SATA SSD)
• 38999 Connector Caps, Mechanical Changes, Custom Metal Finishes
• Program-specific Mil-Certifications / Environmental Testing
• Core 2 Duo 2.16GHz CPU / Core Duo 1.66GHz (Note: thermal/power/EMI specs and qualification would require revalidation)
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